深圳市中立信电子科技有限公司

1 Device Overview

1

1.1 Features 1

• General

– Integrates RF, Power Amplifiers (PAs), Clock,

RF Switches, Filters, Passives, and Power

Management

– Quick Hardware Design With TI Module

Collateral and Reference Designs

– Operating Temperature: –20°C to +70°C

– Small Form Factor: 13.3 × 13.4 × 2 mm

– 100-Pin MOC Package

– FCC, IC, ETSI/CE, and TELEC Certified With

PCB, Dipole, Chip, and PIFA Antennas

• Wi-Fi®

– WLAN Baseband Processor and RF Transceiver

Support of IEEE Std 802.11b, 802.11g, and

802.11n

– 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO

at 2.4 GHz for High Throughput: 80 Mbps

(TCP), 100 Mbps (UDP)

– 2.4-GHz MRC Support for Extended Range

– Fully Calibrated: Production Calibration Not

Required

– 4-Bit SDIO Host Interface Support

– Wi-Fi Direct Concurrent Operation

(Multichannel, Multirole)

• Bluetooth® and Bluetooth low energy

(WL183xMOD Only)

– Bluetooth 4.2 Secure Connection Compliant and

CSA2 Support (Declaration ID: D032799)

– Host Controller Interface (HCI) Transport for

Bluetooth Over UART

– Dedicated Audio Processor Support of SBC

Encoding + A2DP

– Dual-Mode Bluetooth and Bluetooth Low Energy

– TI's Bluetooth- and Bluetooth Low EnergyCertified

Stack

• Key Benefits

– Reduces Design Overhead

– Differentiated Use Cases by Configuring

WiLink™ 8 Simultaneously in Two Roles (STA

and AP) to Connect Directly With Other Wi-Fi

Devices on Different RF Channel (Wi-Fi

Networks)

– Best-in-Class Wi-Fi With High-Performance

Audio and Video Streaming Reference

Applications With Up to 1.4× the Range Versus

One Antenna

– Different Provisioning Methods for In-Home

Devices Connectivity to Wi-Fi in One Step

– Lowest Wi-Fi Power Consumption in Connected

Idle (< 800 μA)

– Configurable Wake on WLAN Filters to Only

Wake Up the System

– Wi-Fi-Bluetooth Single Antenna Coexistence

1.2 Applications

• Internet of Things (IoT)

• Multimedia

• Home Electronics

• Home Appliances and White Goods